[EFFICIENT HARDWARE + INFRASTRUCTURE DESIGN TRACK]: Data Center Design Trends - Optimising Density and Cooling Systems for Efficiency Improvements | Kisaco Research
Session Topics: 
Systems
Hardware
Infrastructure
Sponsor(s): 
Mikros Technologies
Speaker(s): 
Moderator

Author:

Drew Matter

President & CEO
Mikros Technologies

Drew Matter leads Mikros Technologies, a designer and manufacturer of best-in-class direct liquid cold plates for AI/HPC, semiconductor testing, laser & optics, and power electronics.  Mikros provides leading microchannel thermal solutions in single-phase, 2-phase, DLC and immersion systems to leading companies around the world. 

Drew Matter

President & CEO
Mikros Technologies

Drew Matter leads Mikros Technologies, a designer and manufacturer of best-in-class direct liquid cold plates for AI/HPC, semiconductor testing, laser & optics, and power electronics.  Mikros provides leading microchannel thermal solutions in single-phase, 2-phase, DLC and immersion systems to leading companies around the world. 

Author:

Steve Mills

Mechanical Engineer
Meta

Steve Mills is a Mechanical Engineer who has dedicated over 25 years to the development of IT hardware in the enterprise and hyperscale space.  After tours at DELL and Storspeed, he joined Meta in 2012 and is currently a Technical Lead for Data Center and Hardware Interfaces. He also serves on the Open Compute Project Steering Committee representing the Cooling Environments Project. He has 48 US patents and is an author of eight papers covering the packaging and cooling of electronics.

 

 

 

Steve Mills

Mechanical Engineer
Meta

Steve Mills is a Mechanical Engineer who has dedicated over 25 years to the development of IT hardware in the enterprise and hyperscale space.  After tours at DELL and Storspeed, he joined Meta in 2012 and is currently a Technical Lead for Data Center and Hardware Interfaces. He also serves on the Open Compute Project Steering Committee representing the Cooling Environments Project. He has 48 US patents and is an author of eight papers covering the packaging and cooling of electronics.

 

 

 

Author:

Matt Archibald

Director of Technical Architecture – Data Solutions
nVent

Matt Archibald is the Director of Technical Architecture at nVent supporting the data center and networking space. Matt is deeply focused on liquid cooling (close-coupled and direct-to-chip), unified infrastructure management, data center monitoring, and automated data center infrastructure management.

Matt Archibald

Director of Technical Architecture – Data Solutions
nVent

Matt Archibald is the Director of Technical Architecture at nVent supporting the data center and networking space. Matt is deeply focused on liquid cooling (close-coupled and direct-to-chip), unified infrastructure management, data center monitoring, and automated data center infrastructure management.

Author:

Vinod Kamath

Distinguished Engineer
Lenovo Infrastructure Solutions Group

Vinod Kamath

Distinguished Engineer
Lenovo Infrastructure Solutions Group