The exponential growth in compute demands of AI, and the move to Software Defined Products, means that more than ever workloads are defining the semiconductor requirements. The need to hit the restrictive power, performance, area and cost constraints of edge designs, mean that every element of the design needs to be optimized and co-designed with the workloads in mind. Additionally, the design needs to evolve even after semiconductor design is complete as it adapts to new demands.
In this presentation we will look at how semiconductor design is changing to enable rapid development and deployment of custom, application optimized, system-on-chip designs – from concept through to in-life operation, as we chart the path to a sustainable compute future.
![](https://aihwedgesummit.com/sites/default/files/styles/panopoly_image_square/public/speakers/ankur_gupta_headshot.jpg?itok=5Ws1Ymqb&c=e6be4ff9d7ad1f976a4f8fa2cef9cd0a)
Ankur Gupta
Ankur Gupta is Senior Vice President and General Manager of Digital Design Creation at Siemens EDA. This includes Test, Embedded Analytics, Digital IC design, Power Optimization, and Power Integrity Analysis. Formerly he was head of Product Management and Applications at Ansys, Semiconductor and Head of Applications Engineering for Digital Implementation & Signoff at Cadence Design Systems.
Ankur has 20+ years of experience in EDA, working on some of the industry’s most innovative Test, Digital Design, Implementation and Signoff products. He holds a Master’s Degree in Electrical and Computer Engineering, from Iowa State University.